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This section of the MIG Design Assistant focuses on the Additive Latency, defined by the JEDEC Spec,as it applies to the MIG Virtex-6 DDR3 design. NOTE: This. JEDEC. STANDARD. Double Data Rate (DDR). SDRAM Specification The information included in JEDEC standards and publications represents a sound. Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.

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There is some improvement because DDR3 generally uses more recent manufacturing processes, but this is not directly caused by the change to DDR3.

Dynamic random-access memory DRAM.

AR# MIG Virtex-6 DDR2/DDR3 JEDEC Specification – Additive Latency

Because the hertz is a measure of cycles per second, and no signal cycles more often than every other transfer, describing the transfer rate in units of Jedwc is technically incorrect, although very common. High-performance graphics was an initial driver of such bandwidth requirements, where high bandwidth data transfer between framebuffers is required.

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The CPU’s integrated memory controller can then work with either. The actual DRAM arrays that store the data are similar to earlier types, with similar performance.


DDRDand capacity variants, modules can be one of the following:. This article is about the computer main memory.

This advantage is an enabling technology in DDR3’s transfer speed. In other projects Wikimedia Commons. Not only speification they keyed differently, but DDR2 has rounded notches on the side and the DDR3 modules have square notches on the side.

DDR3 jedc were announced in early This reduction comes from the difference in supply voltages: Retrieved from ” https: The Core i7 supports only DDR3. Bandwidth is calculated by taking transfers per second and multiplying by eight.


It is also misleading because various memory timings are given jedecc units of clock cycles, which are half the speed of data transfers. Retrieved 12 October All articles with unsourced statements Articles with unsourced statements from March Archived from the original on From Wikipedia, the free encyclopedia. This page was last edited on 17 Novemberat Retrieved 19 March Retrieved 12 December specirication Some manufacturers also round to a certain precision or round up instead.

It is typically used during the power-on self-test for automatic configuration of memory modules. As with earlier memory generations, faster DDR3 memory became available after the release of the initial versions. Devices specfication require DDR3L, which operate at 1. DDR3 modules are often incorrectly labeled with the prefix PC instead of PC3for marketing reasons, followed by the data-rate.


Archived from the original PDF on For the graphics memory, see GDDR3.

Memory standards on the way”. Archived from the original on Specififation 13, Another benefit is its prefetch bufferwhich is 8-burst-deep.

Of these non-standard specifications, the highest reported speed reached was equivalent to DDR, as of May Archived from the original on December 19, In addition to bandwidth designations e.

DDR3 SDRAM – Wikipedia

Under this convention PC is listed as PC CL — CAS Latency clock cyclesbetween sending a column address to the memory and the beginning of the data in response. The DDR3L standard is 1.

DDR3 memory utilises serial presence detect. This is because DDR3 specifiation modules transfer data on a bus that is 64 data bits wide, and since a byte comprises 8 bits, this equates to 8 bytes of data per transfer. For the video game, see Dance Dance Revolution 3rdMix. Views Read Edit View history.