Single Pulse. D= DSEI 2x t [s]. I F. [A. ] -diF /dt [A/µs]. VF [V]. Q r. [µ. C]. -diF /dt [A/µs]. I RM. [A. ] -diF /dt [A/µs]. -diF /dt [A/µs]. DSEI 2X A IXYS Rectifiers datasheet, inventory, & pricing. IXYS DSEI-2XA Rectifiers are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for IXYS DSEI-2XA Rectifiers.
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These new devices feature low static drain to source on-resistances and provide unparalleled performance and reliability in controlled current output applications. To make this website work, we log user data and share it with processors.
Phase control thyristors are designed for optimal forward conduction and reverse blocking characteristics, due to only moderate requirements for turn-on and turn-off parameters. One office mail login One office mail login One office mail login Our callback service is not available for the number provided.
The normally-on operational mode of these devices combined with an enhanced linear operating capability allows for an ideal device selection in current sources, current regulators, solid-state dstasheet, level shifting, active loads, start-up circuits, and active power filters.
Package styleOutline drawings on pages O It is feasible to use standard housings with appropriate accessories for designing compact power converter operating from AC mains up to V.
Outline drawingson pages O Our experienced, international, team of engineers is on hand to help our customers to get more from their products and keep at the forefront of technology in an increasingly competitive marketplace. Windows login outlook Windows login outlook Windows datasheeet outlook In most cases, Office is activated once you start an application and after you click Accept to agree to the License terms.
Another interesting feature is the capa-bility to pattern the DCB substrate like a printed circuit board. O W9 Weight 90 g W11 Weight g. See alphanumeric index for the page number of the particular product.
O W17 Weight g W18 Weight g Isolation capability from leads to backside RMS no exterl isolation foil needed Thermal resistance from Junction to Case only slightly higher as for nonisolated version Increased power- and temperature cycling capability DCB can be patterned like printed circuit boards allowing special functions to be realized DCB Mould Copper Ceramic Copper Solder Example: Furthermore, these new devices eliminate the need for discrete anti-parallel high voltage diodes used in conventional designs, thereby reducing part count, simplifying PCB layouts, reducing overall losses and improving power density.
All prices are subject to change without notice. Comparing a device in ISOPLUS to its companion in the non-isolated package with an exterl isolation foil, one can see that the overall R th is now lower for the part in the already isolated package see example.
It has up to five terminal pins, making it possible to build up full diode bridges, phase-leg transistor configurations, buck and boost converters and much more within one isolated discrete package. In fact, any application which requires a fast, low loss diode.
These switches are ideal for controlling a variety of C circuits in industrial environments where electromagnetic interference would disrupt the operation of electromechanical relays. At increasing switching frequencies, the proper functioning and efficiency of the power switch, aside from conduction losses, is determined by the turn-off behavior of the diode characterized by Q rr, I RM and t rr – 1.
Further it givesalways the best ruggedness and performance versus short term power peaks and high surge currents. The following pages show a selection of accessories available to our customers, from heatsinks and coolers, to bar or box clamps, to mounting grease!! Common IGBT desi and topologies www. Terms of delivery and rights to change design or specifications are reserved.
IXGH 2N 2 3. This chip design supercedes the design of thyristor chips which were fabricated with passivation moats so that modules of the new series designed with the updated stateof-the-art utilize planar passivated chips processed by separation diffusion techniques.
Featuring compression bonded, alloyed Silicon wafer construction, these devices feature low thermal impedance and high overload capacity and are designed to survive even the most arduous applications. SimBus A is a module conception for easy and fast mounting.
Package StyleOutline drawings onpages O These are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. Xc Xb Outline drawings on pages O When these factors are known, the.
The Wespack outline WPxx is a new concept in phase control thyristors for applications requiring devices rated to It gives the maximum power rating for weight and volume without compromising on quality and reliability.