IEC Standard | General requirements and measuring methods for printed wiring boards. IEC Printed Boards Part 3: Design and Use of Printed Boards. IEC Printed Boards Part 2: Test Methods.
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We have no document history for this standard. Guide for the specification writer Status: The faster, easier way to work with standards. Subscription pricing is determined by: Printed circuits and boards. Take the smart route to manage medical device compliance.
Describes standard test methods for assessing the properties, dimensions.
Contains fundamental information on the design and the application of printed boards, their technical limitations and the features and characteristics which can normally be obtained and expected. You can download and open this file to your own computer but DRM prevents opening this file on another computer, including a networked server. Message to your colleague. Search all products by. Learn more about the cookies we use and how to change your settings. If the document is revised or amended, you will be notified by email.
This website is best viewed with browser version of up to Microsoft Internet Explorer 8 or Firefox 3. You may find similar items within these categories by selecting from the choices below:. It is divided into separate parts covering information for the designer, recommendations for the specification writer, test methods and requirements for the various types of printed boards.
Applicable to printed boards, irrespective of their method of manufacture, when they are ready for the mounting of the components. Printed-circuit boards, Printed circuits, Electronic equipment and components, Standards, Specification approvalProduct specification, Detail specification, Quality assurance systems, Assessed quality, Technical writing.
Catalogue of test methods. Subscribe on standards – Read more. BSBS When you use our service you can be assured the latest editions and easy access.
Measurement of melting temperature or melting temperature ranges of solder alloys. Add to Alert PDF. SS-EN Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part